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JEDEC JESD22-B112A
- PACKAGE WARPAGE MEASUREMENT OF SURFACE-MOUNT INTEGRATED CIRCUITS AT ELEVATED TEMPERATURE
- standard by JEDEC Solid State Technology Association, 10/01/2009
- Publisher: JEDEC
$37.00$74.00
The purpose of this test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of environmental conditions experienced during the surface-mount soldering operation.
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