SME EE00-147

Solder Jet Technology (e.g. piezoelectric demand-mode ink-jet printing technology used to dispense molten solder droplets) has demonstrated the ability to place 25- 125(m diameter bumps onto metallized wafers, circuit boards, and other substrates. Recent developments are discussed, including test vehicle printing, drop size modulation, microbump printing, and print-on-the-fly.

Product Details

Published:

11/01/2000

Number of Pages:

4

File Size:

1 file , 510 KB