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  • SME AD910398
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SME AD910398

  • Alternatives To Solvent Bonding And How To Design For Them
  • standard by Society of Manufacturing Engineers, 06/01/1991
  • Publisher: SME

$9.00$18.00


THIS PAPER PRESENTS THE NUMEROUS BONDING TECHNOLOGY FOR THERMOPLASTICS. IT ENFORCES HOW CURRENT ADHESIVE TECHNOLOGY CAN REPLACE SOLVENTS. RECOMMENDATIONS ON HOW TO DESIGN JOINTS ARE PRESENTED.

Product Details

Published:
06/01/1991
Number of Pages:
12
File Size:
1 file , 660 KB

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