Provide PDF Format
JEDEC JESD22-A122
- POWER CYCLING
- standard by JEDEC Solid State Technology Association, 08/01/2007
- Publisher: JEDEC
$30.00$59.00
This Test Method establishes a uniform method for performing component package power cycling stress test. This specification covers power induced temperature cycling of a packaged component, simulating the non-uniform temperature distribution resulting from a device powering on and off in the application.
Related Products
JEDEC JESD74A
EARLY LIFE FAILURE RATE CALCULATION PROCEDURE FOR SEMICONDUCTOR COMPONENTS..
$39.00 $78.00