Provide PDF Format
JEDEC JEP154
- GUIDELINE FOR CHARACTERIZING SOLDER BUMP ELECTROMIGRATION UNDER CONSTANT CURRENT AND TEMPERATURE STRESS
- standard by JEDEC Solid State Technology Association, 01/01/2008
- Publisher: JEDEC
$38.00$76.00
This document describes a method to test the electromigration (EM) susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages. The method is valid for Sn/Pb eutectic, high Pb, and Pb-free solder bumps. The document discusses the advantages and concerns associated with EM testing, as well as options for data analysis.
Related Products
JEDEC JESD51-5
EXTENSION OF THERMAL TEST BOARD STANDARDS FOR PACKAGES WITH DIRECT THERMAL ATTACHMENT MECHANISMS..
$24.00 $48.00
JEDEC JESD 46C
CUSTOMER NOTIFICATION OF PRODUCT/PROCESS CHANGES BY SEMICONDUCTOR SUPPLIERS..
$27.00 $53.00
